Samsung Electronics will use its second semiconductor plant in Taylor, Texas, to produce base dies for high-bandwidth memory (HBM) chips for AMD and Nvidia, according to South Korea’s Maeil Business Newspaper, which cited industry sources, in a Reuters report published by WHTC.

Construction is due to start formally this month, with the plant having secured orders for its entire output, most of it for AMD. The facility will use 2-nanometer technology and cover about 2.7 million square feet, roughly 1.5 times the size of the first plant, which has a contract with Tesla. Equipment is expected to be installed from February 2029, with mass production in 2030.